3D Sensors Market 2020: Analysis by Size, Share, Opportunities, Growth, Emerging Technologies, And Regional Forecast To 2023

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Overview:

The global 3D sensors market is spanned across North America, Europe, Asia-Pacific, and the rest of the world. Asia-Pacific accounted for the largest market share of 35.9% in 2017, with a market value of USD 403.5 million; the market is expected to register the highest CAGR of 31.2% during the forecast period. North America was the second-largest market in 2017, valued at USD 332.1 million; the market is projected to exhibit a CAGR of 28.3%.

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The growth in the Asia-Pacific region is driven by the increased adoption of 3D sensors for transportation and logistics, medical devices, automobiles, and consumer electronics. The popularity of connected devices along with the adoption of object detection devices for security solutions is expected to fuel market growth. On the other hand, the North American region is expected to witness a significant growth in the 3D sensors market owing to the presence of major key players such as Microsoft Corporation, Intel Corporation, and Microchip Technology, Inc. Moreover, the region is the earliest adopter of AR/VR technology, connected devices, and IoT. This has resulted in the growth of the North American region in the 3D sensors market. However, the European region is witnessing a major demand for 3D sensing technology for smart homes and gaming applications. The UK has largely adopted smart homes along with industrial robots which has largely contributed to the demand for 3D sensors in this region.

The global 3D sensors market is expected to reach USD 4,807.3 million at a CAGR of over 27.88% by the end of the forecast period 2018–2023.

Taste the market data and market information presented through more than 30 market data tables and figures spread over 100 numbers of pages of the project report. Avail the in-depth table of content TOC & market synopsis on “Global 3D Sensors Market Research Report -Forecast to 2023”.

Segmentation:

The global 3D sensors market has been segmented on the basis of technology, type, end-user, and region. The technology segment has been segmented into projected-light/structured-light, stereo vision, time-of-flight, and ultrasound. The type segment has been segmented into acoustic sensors, accelerometer sensors, image sensors, and others. The end-user segment has been sub-segmented into industrial, automotive, logistics, aerospace & defense, consumer electronics, healthcare, and medical devices. The region includes North America, Europe, Asia Pacific, and the rest of the world.

Regional Analysis:

The regional analysis of the 3D sensor market finds that the market is growing with positive growth seen in all the regions. The increasing demand for 3D imaging across all the segments and the increasing need for security, surveillance and progress in technology is motivating the market on a global scale. The regions encompassed in the market are Europe, North America, Asia Pacific and Rest of the World. The North American region is governing the 3D sensor market global share due to the presence of a large number of 3D sensor suppliers related to technical experts. The U.S and Canada are the principal nations in the North American region. Moreover, the Asia Pacific region stands second in terms of revenue in the 3D sensor market. This can be attributed to the upsurge in the implementation of 3D sensors across industrial verticals like medical, consumer electronics and gaming.  China, Japan and India are deduced to be the foremost regions of the Asia Pacific region. The European stands as the third largest region owing to the technological development in the field of artificial intelligence.

Key Players:

Some of the prominent players in the global 3D sensors market are Microsoft Corporation (US), Sony Corporation (Japan), ST Microelectronics NV (Switzerland), Infineon Technologies AG (Germany), Intel Corporation (US), Microchip Technology, Inc. (US), Qualcomm Technologies Inc. (US), Texas Instruments Incorporated (US), ASUSTeK Computer Inc. (Taiwan), ams AG (Austria), Finisar Corporation (US), Sick AG (Germany), Cognex Corporation (US), Occipital Inc. (US), and Xovis AG  (Switzerland).

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