Devices Inc. (U.S.), Altera Corp. (U.S.), Broadcom Corp. (U.S.), NXP Semiconductor (Netherlands), Qualcomm Inc. (U.S.), Renesas Electronics Corp.(Japan), Samsung Electronics Co. Ltd. (South Korea), Toshiba Corp. (Japan), Texas Instruments Inc. (U.S.) and Xilinx Inc. (U.S.) among others. among others are some of the prominent players profiled in MRFR Analysis and are at the forefront of competition in the global Digital Signal Processors (DSP) market. Automotive, Consumer electronics, Communication, Nano technology, Surveillance among others are some of the major application areas where DSP offers wide range of benefits which supports the market growth.
A Digital Signal Processor, or DSP, is a microprocessor specialized architect for fast-operational needs of digital signal processing. A Digital Signal Processor or DSP is specifically designed for those application which is requires the data in real time and can’t tolerate delays. DSP take a digital signal from its source and amplifies or process it to improve the signal. DSP uses video, voice, audio, temperature or position signals which have been digitized and manipulate them mathematically. High speed and high accuracy while performing the mathematic manipulation is one of the major benefit which DSP offers to their clients. growing industries such as IT and telecommunication, gaming, consumer electronics are some of the major driving factor of DSP market.
High advancement in technologies and high development in the field of wireless infrastructure is also supporting the market growth. In the past few years, surveillance industry has also seen rapid growth which is majorly due to the high demand for IP cameras and advance video surveillance resulting in global demand for DSP microprocessors. DSP also offers cost benefits to the high-performance communication system leading to heavy demand from telecom industry. Several industries such as consumer electronics and ICT has seen rapid growth in the last 10 years. Increasing per capita income and government initiatives have also played an important role the growth of digital signal processors.
December, 2017, Toshiba America Electronic Components, Inc., a committed technology leader, today announced a new IC that is compliant with the Bluetooth® Low Energy (LE) core specification 4.2 – including support for a secure connection, LE privacy features and extended packet length. The new TC35679IFTG is designed for use in harsh automotive environments and extended temperature ranges. A mixed-signal device, the TC35679IFTG contains both analog RF and baseband digital parts. This enables it to provide a complete solution in a single, compact, low-profile (40-pin 6mm x 6mm x 1mm) QFN ‘wettable flank’ package with a pin pitch of 0.5mm. The TC35679 provides Bluetooth Host Control Interface (HCI) functions alongside low energy GATT profile functions (as defined by Bluetooth specifications). The new IC becomes a fully fledged application processor when used in conjunction with external non-volatile memory. It can also be used in combination with an external host processor.
December, 2017, Renesas Electronics America Inc., a premier supplier of advanced semiconductor solutions, today expanded its Renesas IoT Sandbox lineup with the new RX65N Wi-Fi Cloud Connectivity Kit, offering greater flexibility for developers creating new applications for the Internet of Things (IoT). Powered by Renesas IoT Sandbox, the RX65N Wi-Fi Cloud Connectivity Kit provides an easy-to-use platform for connecting to the cloud, evaluating IoT solutions, and creating IoT applications through cloud services and real-time workflows. The RX65N Wi-Fi Cloud Connectivity Kit integrates the high-performance Renesas RX65N microcontroller (MCU) and Medium One’s Smart Proximity demo with the data intelligence featured in Renesas IoT Sandbox. This powerful combination enables customers to reduce the complexity barriers associated with IoT application development and significantly accelerate the prototyping process.
April, 2017, Knowles Corporation, a market leader and global supplier of advanced micro-acoustic, audio processing, and precision device solutions, announced it has sampled the new IA-610 smart microphone, combining a world-leading MEMS microphone with a best-in-class open digital signal processor (DSP) into a single subminiature package. This complete and customizable solution is similar in size to a MEMS microphone found in today’s leading mobile electronic devices. The IA-610 smart microphone provides an open DSP platform, enabling OEMs and third-party software developers to create and customize advanced features, or leverage Knowles industry-leading software and algorithms for a turnkey solution.
Segmentation by Components: ICs, single and multi-core processors, system-on chip (SOC), and input-output controllers among others.
Segmentation by Application: Automotive, Consumer electronics, Communication, Nano technology, Surveillance and Medical among others.
Digital Signal Processor (DSP) Market is growing with the positive growth in all the regions. Increasing application areas on yearly basis and advancement in technology is driving the market on global scale. North America is dominating the market of DSP due to the rich presence of technology companies in U.S. and Canada. The region is also a leader in technology which gives it a competitive advantage over other countries. High development in the field of IT and telecommunication in the region is also one of the major factor driving the market. Asia-Pacific region has emerged as fastest growing market and holds second position the global market. Rich presence of semiconductor companies in the region and one of the largest exporter of semiconductor products is playing major role in the growth of DSP market. Europe stands as third largest market due to the presence of developed countries in the region. Growing surveillance market in the region is one of the major driving factor which is supporting the market growth.
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