Flip chip technology is basically a semiconductor device with the intention to provide a secured connection between the component and the board. Among its major part, solder bumps, over the connection pads of the IC or micro-electromechanical system (MEMS) play a significant role in maintaining a seamless functional operation. The global flip chip technology market is expecting a move up by 8.29% CAGR during the forecast period (2017-2023). Market Research Future (MRFR), has some better insights regarding the flip chip technology market and they have delivered that in their report.
Electronics industry, with high packaging density, is expected to promote the demand for the flip chip technology market. This would ensure better performance of various devices and it could lead to improved percolation of devices into other industries.
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MRFR’s argument regarding the global flip chip technology market is based on a detailed segmentation. The segmentation includes wafer bumping process, packaging technology, packaging type, product, and application.
Based on the wafer bumping process, the flip chip technology market can be segmented into copper (CU) pillar, lead-free, Tin-lead eutectic solder and gold stud plated solder.
Based on the packaging technology, the flip chip technology market ca be segmented into 2D, 2.5D, and 3D packaging technology.
Based on the packaging type, the flip chip technology market comprises FC PGA (Flip Chip Pin Grid Array), FC LGA (Flip Chip Land Grid Array), FC QFN (Flip Chip Quad Flat No-Lead), FC SIP (Flip Chip System-In-Package), FC BGA (Flip Chip Ball Grid Array), and FC CSP (Flip Chip-Chip-Scale Package).
Based on the product, the flip chip technology market can be segmented into LED, RF, Analog, Mixed Signal, CMOS image sensor, CPU, and Power IC, SoC and others. The LED segment is gaining grounds in various devices, its integration in the entertainment industry is massive. On the other hand, CMOS image sensor is gaining grounds due to a surge in camera sale.
Based on the end-user, the flip chip technology market includes automotive, medical devices, telecommunications, industrial, military & aerospace, consumer electronics, and others. The consumer electronics segment is having substantial ingress of the technology. The telecommunication technology is also providing thrust for the market movement.
Geographic analysis of the global flip chip technology market incorporates North America, Asia Pacific (APAC), Europe, and Rest of the World (RoW). Such a vast analysis has its focus on understanding growth pockets that can impact the global market.
The APAC market has the lead position in the market. This is due to the high integration of flip chip technology market in various industries from developing countries. Government initiatives are helping industries in solidifying their state by incorporating better technologies. Countries, like China and India, are emerging as significant manufacturing hubs and are creating excellent opportunities for the growth of this market. The presence of major companies like Samsung and Sony are helping the market in its growth.
North America’s burgeoning market relies mainly on several well-established industries and their capacity to invest in upgradation process of their manufacturing units. At the same time, the region is also spending substantially to innovate products and create better facilities for research and development sector.
Several companies are introducing their own strategic moves to develop global flip chip technology market. The primary intension is to gain traction for themselves, however, the method provides holistic thrust to the global market. MRFR included and profiled several companies, they are Intel Corporation (U.S.), Samsung Group (South Korea), UMC (Taiwan), ASE, Inc. (Taiwan), Amkor Technology (U.S.), Global Foundries (U.S.), Powertech Technology (Taiwan), and STMicroelectronics (Switzerland), STATS ChipPAC (Singapore), Texas Instruments (U.S.), and others.
In July 2019, TDK showcased their latest AFM 15 Flip Chip Gold that would feature horn capability, which would even impact even smaller die size of 80μm2 up to 20mm2.
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